Copper Wire Bonding,9781461457602

Copper Wire Bonding

by ; ; ;
ISBN13: 9781461457602
ISBN10: 1461457602
Format: Hardcover
Pub. Date: 2013-10-07
Publisher(s): Springer Verlag
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Summary

Copper Wire Bonding provides an in-depth presentation of Cu wire bonding technology, a comparison of various metallurgies, and a range of rigorously designed reliability tests. Due to the increasing cost of materials, the electronics industry is rapidly moving towards copper wire bonding in place of gold. Replacing gold with copper in the wire bond process presents many challenges, and the conversion to the copper wire bonding requires new process optimization, parameter adjustments for ball bond formation, stitch bond formation, and looping profiles. Because of the ongoing trend toward Cu wire bonding, it is essential to understand the basic differences between Au and Cu wire bonding so that manufacturing processes and reliability tests can be modified. Further evaluation of bonding metallurgies, process variations, and reliability of copper and copper-palladium wires on various surface finishes also need to be conducted to facilitate the transition. Copper Wire Bonding fills the gap in the current state of knowledge on wire bonding by providing detailed information on all facets of Cu wire bonding technology.

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