Dependability in Electronic Systems
by Kanekawa, Nobuyasu; Ibe, Eishi H.; Suga, Takashi; Uematsu, Yutaka-
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Summary
Table of Contents
| Introduction | p. 1 |
| Trends in Failure Cause and Countermeasure | p. 1 |
| Contents and Organization of This Book | p. 3 |
| For the Best Result | p. 5 |
| References | p. 5 |
| Terrestrial Neutron-Induced Failures in Semiconductor Devices and Relevant Systems and Their Mitigation Techniques | p. 7 |
| Introduction | p. 7 |
| SER in Memory Devices | p. 7 |
| MCU in Memory Devices | p. 8 |
| SET and MNU in Logic Devices | p. 8 |
| Chip/System-Level SER Problem: SER Estimation and Mitigation | p. 9 |
| Scope of This Chapter | p. 9 |
| Basic Knowledge on Terrestrial Neutron-Induced Soft-Error in MOSFET Devices | p. 10 |
| Cosmic Rays from the Outer Space | p. 10 |
| Nuclear Spallation Reaction and Charge Collection in CMOSFET Device | p. 11 |
| Experimental Techniques to Quantify Soft-Error Rate (SER) and Their Standardization | p. 12 |
| The System to Quantify SER - SECIS | p. 12 |
| Basic Method in JESD89A | p. 13 |
| SEE Classification Techniques in Time Domain | p. 15 |
| MCU Classification Techniques in Topological Space Domain | p. 16 |
| Evolution of Multi-node Upset Problem | p. 17 |
| MCU Characterization by Accelerator-Based Experiments | p. 17 |
| Multi-coupled Bipolar Interaction (MCBI) | p. 21 |
| Simulation Techniques for Neutron-Induced Soft Error | p. 23 |
| Overall Microscopic Soft-Error Model | p. 23 |
| Nuclear Spallation Reaction Models | p. 24 |
| Charge Deposition Model | p. 24 |
| SRAM Device Model | p. 26 |
| Cell Matrix Model | p. 27 |
| Recycle Simulation Method | p. 28 |
| Validation of SRAM Model | p. 29 |
| Prediction for Scaling Effects Down to 22 nm Design Rule in SRAMs | p. 29 |
| Roadmap Assumption | p. 29 |
| Results and Discussions | p. 30 |
| Validity of Simulated Results | p. 39 |
| SER Estimation in Devices/Components/System | p. 40 |
| Standards for SER Measurement for Memories | p. 40 |
| Revisions Needed for the Standards | p. 40 |
| Quantification of SER in Logic Devices and Related Issues | p. 42 |
| An Example of Chip/Board-Level SER Measurement and Architectural Mitigation Techniques | p. 43 |
| SER Test Procedures for Network Components | p. 43 |
| Results and Discussions | p. 49 |
| Hierarchical Mitigation Strategies | p. 51 |
| Basic Three Approaches | p. 51 |
| Design on the Upper Bound (DOUB) | p. 52 |
| Inter Layer Built-in Reliability (LABIR) | p. 56 |
| Summary | p. 57 |
| References | p. 59 |
| Electromagnetic Compatibility | p. 65 |
| Introduction | p. 65 |
| Quantitative Estimation of the EMI Radiation Based on the Measured Near-Field Magnetic Distribution | p. 68 |
| Measurement of the Magnetic Field Distribution Near the Circuit Board | p. 68 |
| Calculation of the Electric Current Distribution on the Circuit Board | p. 68 |
| Calculation of the Far-Field Radiated EMI | p. 70 |
| Development of a Non-contact Current Distribution Measurement Technique for LSI Packaging on PCBs | p. 71 |
| Electric Current Distribution Detection | p. 71 |
| The Current Detection Result and Its Verification | p. 74 |
| Reduction Technique of Radiated Emission from Chassis with PCB | p. 75 |
| Far-Field Measurement of Chassis with PCB | p. 75 |
| Measurements of Junction Current | p. 79 |
| PSPICE Modeling | p. 80 |
| Experimental Validation | p. 85 |
| Chapter Summary | p. 86 |
| References | p. 88 |
| Power Integrity | p. 91 |
| Introduction | p. 91 |
| Detrimental Effect and Technical Trends of Power Integrity Design of Electronic Systems and Devices | p. 92 |
| Detrimental Effect by Power Supply Noise on Semiconducting Devices | p. 92 |
| Trends of Power Supply Voltage and Power Supply Current for CMOS Semiconducting Devices | p. 98 |
| Trend of Power Distribution Network Design for Electronic Systems | p. 100 |
| Design Methodology of Power Integrity | p. 102 |
| Definition of Power Supply Noise in Electric System | p. 102 |
| Time-Domain and Frequency-Domain Design Methodology | p. 104 |
| Modeling and Design Methodologies of PDS | p. 115 |
| Modeling of Electrical Circuit Parameters | p. 116 |
| Design Strategies of PDS | p. 121 |
| Simultaneous Switching Noise (SSN) | p. 125 |
| Principle of SSN | p. 126 |
| S-G loop SSN | p. 127 |
| P-G loop SSN | p. 129 |
| Measurement of Power Distribution System Performance | p. 131 |
| On-Chip Voltage Waveform Measurement | p. 131 |
| On-Chip Power Supply Impedance Measurement | p. 137 |
| Summary | p. 140 |
| References | p. 141 |
| Fault-Tolerant System Technology | p. 143 |
| Introduction | p. 143 |
| Metrics for Dependability | p. 144 |
| Reliability | p. 144 |
| Availability | p. 145 |
| Safety | p. 147 |
| Reliability Paradox | p. 148 |
| Survey on Fault-Tolerant Systems | p. 150 |
| Technical Issues | p. 153 |
| High Performance | p. 154 |
| Transparency | p. 156 |
| Physical Transparency | p. 156 |
| Fault Tolerance of Fault Tolerance for Ultimate Safety | p. 157 |
| Reliability of Software | p. 160 |
| Industrial Approach | p. 161 |
| Autonomous Decentralized Systems | p. 163 |
| Space Application | p. 164 |
| Commercial Fault-Tolerant Systems | p. 164 |
| Ultra-Safe System | p. 165 |
| Availability Improvement vs. Coverage Improvement | p. 166 |
| Trade-Off Between Availability and Coverage - Stepwise Negotiating Voting | p. 166 |
| Basic Concept | p. 166 |
| Hiten Onboard Computer | p. 169 |
| Fault-Tolerance Experiments | p. 170 |
| Extension of SNV - Redundancy Management | p. 173 |
| Coverage Improvement | p. 175 |
| Self-Checking Comparator | p. 176 |
| Optimal Time Diversity | p. 179 |
| On-Chip Redundancy | p. 184 |
| High Performance (Commercial Fault-Tolerant Computer) | p. 188 |
| Basic Concepts of TPR Architecture | p. 188 |
| System Configuration | p. 189 |
| System Reconfiguration on Fault Occurrence | p. 191 |
| Processing Take-Over on Fault Occurrence | p. 191 |
| Fault Tolerance of Fault Tolerance | p. 192 |
| Commercial Product Model | p. 195 |
| Current Application Field: X-by-Wire | p. 196 |
| References | p. 198 |
| Challenges in the Future | p. 201 |
| References | p. 202 |
| Index | p. 203 |
| Table of Contents provided by Ingram. All Rights Reserved. |
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