Dependability in Electronic Systems

by ; ; ;
Format: Hardcover
Pub. Date: 2010-11-01
Publisher(s): Springer Verlag
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Summary

This book covers the practical application of dependable electronic systems in real industry, such as space, train control and automotive control systems, and network servers/routers. The impact from intermittent errors caused by environmental radiation (neutrons and alpha particles) and EMI (Electro-Magnetic Interference) are introduced together with their most advanced countermeasures. Power Integration is included as one of the most important bases of dependability in electronic systems. Fundamental technical background is provided, along with practical design examples.Readers will obtain an overall picture of dependability from failure causes to countermeasures for their relevant systems or products, and therefore, will be able to select the best choice for maximum dependability.

Table of Contents

Introductionp. 1
Trends in Failure Cause and Countermeasurep. 1
Contents and Organization of This Bookp. 3
For the Best Resultp. 5
Referencesp. 5
Terrestrial Neutron-Induced Failures in Semiconductor Devices and Relevant Systems and Their Mitigation Techniquesp. 7
Introductionp. 7
SER in Memory Devicesp. 7
MCU in Memory Devicesp. 8
SET and MNU in Logic Devicesp. 8
Chip/System-Level SER Problem: SER Estimation and Mitigationp. 9
Scope of This Chapterp. 9
Basic Knowledge on Terrestrial Neutron-Induced Soft-Error in MOSFET Devicesp. 10
Cosmic Rays from the Outer Spacep. 10
Nuclear Spallation Reaction and Charge Collection in CMOSFET Devicep. 11
Experimental Techniques to Quantify Soft-Error Rate (SER) and Their Standardizationp. 12
The System to Quantify SER - SECISp. 12
Basic Method in JESD89Ap. 13
SEE Classification Techniques in Time Domainp. 15
MCU Classification Techniques in Topological Space Domainp. 16
Evolution of Multi-node Upset Problemp. 17
MCU Characterization by Accelerator-Based Experimentsp. 17
Multi-coupled Bipolar Interaction (MCBI)p. 21
Simulation Techniques for Neutron-Induced Soft Errorp. 23
Overall Microscopic Soft-Error Modelp. 23
Nuclear Spallation Reaction Modelsp. 24
Charge Deposition Modelp. 24
SRAM Device Modelp. 26
Cell Matrix Modelp. 27
Recycle Simulation Methodp. 28
Validation of SRAM Modelp. 29
Prediction for Scaling Effects Down to 22 nm Design Rule in SRAMsp. 29
Roadmap Assumptionp. 29
Results and Discussionsp. 30
Validity of Simulated Resultsp. 39
SER Estimation in Devices/Components/Systemp. 40
Standards for SER Measurement for Memoriesp. 40
Revisions Needed for the Standardsp. 40
Quantification of SER in Logic Devices and Related Issuesp. 42
An Example of Chip/Board-Level SER Measurement and Architectural Mitigation Techniquesp. 43
SER Test Procedures for Network Componentsp. 43
Results and Discussionsp. 49
Hierarchical Mitigation Strategiesp. 51
Basic Three Approachesp. 51
Design on the Upper Bound (DOUB)p. 52
Inter Layer Built-in Reliability (LABIR)p. 56
Summaryp. 57
Referencesp. 59
Electromagnetic Compatibilityp. 65
Introductionp. 65
Quantitative Estimation of the EMI Radiation Based on the Measured Near-Field Magnetic Distributionp. 68
Measurement of the Magnetic Field Distribution Near the Circuit Boardp. 68
Calculation of the Electric Current Distribution on the Circuit Boardp. 68
Calculation of the Far-Field Radiated EMIp. 70
Development of a Non-contact Current Distribution Measurement Technique for LSI Packaging on PCBsp. 71
Electric Current Distribution Detectionp. 71
The Current Detection Result and Its Verificationp. 74
Reduction Technique of Radiated Emission from Chassis with PCBp. 75
Far-Field Measurement of Chassis with PCBp. 75
Measurements of Junction Currentp. 79
PSPICE Modelingp. 80
Experimental Validationp. 85
Chapter Summaryp. 86
Referencesp. 88
Power Integrityp. 91
Introductionp. 91
Detrimental Effect and Technical Trends of Power Integrity Design of Electronic Systems and Devicesp. 92
Detrimental Effect by Power Supply Noise on Semiconducting Devicesp. 92
Trends of Power Supply Voltage and Power Supply Current for CMOS Semiconducting Devicesp. 98
Trend of Power Distribution Network Design for Electronic Systemsp. 100
Design Methodology of Power Integrityp. 102
Definition of Power Supply Noise in Electric Systemp. 102
Time-Domain and Frequency-Domain Design Methodologyp. 104
Modeling and Design Methodologies of PDSp. 115
Modeling of Electrical Circuit Parametersp. 116
Design Strategies of PDSp. 121
Simultaneous Switching Noise (SSN)p. 125
Principle of SSNp. 126
S-G loop SSNp. 127
P-G loop SSNp. 129
Measurement of Power Distribution System Performancep. 131
On-Chip Voltage Waveform Measurementp. 131
On-Chip Power Supply Impedance Measurementp. 137
Summaryp. 140
Referencesp. 141
Fault-Tolerant System Technologyp. 143
Introductionp. 143
Metrics for Dependabilityp. 144
Reliabilityp. 144
Availabilityp. 145
Safetyp. 147
Reliability Paradoxp. 148
Survey on Fault-Tolerant Systemsp. 150
Technical Issuesp. 153
High Performancep. 154
Transparencyp. 156
Physical Transparencyp. 156
Fault Tolerance of Fault Tolerance for Ultimate Safetyp. 157
Reliability of Softwarep. 160
Industrial Approachp. 161
Autonomous Decentralized Systemsp. 163
Space Applicationp. 164
Commercial Fault-Tolerant Systemsp. 164
Ultra-Safe Systemp. 165
Availability Improvement vs. Coverage Improvementp. 166
Trade-Off Between Availability and Coverage - Stepwise Negotiating Votingp. 166
Basic Conceptp. 166
Hiten Onboard Computerp. 169
Fault-Tolerance Experimentsp. 170
Extension of SNV - Redundancy Managementp. 173
Coverage Improvementp. 175
Self-Checking Comparatorp. 176
Optimal Time Diversityp. 179
On-Chip Redundancyp. 184
High Performance (Commercial Fault-Tolerant Computer)p. 188
Basic Concepts of TPR Architecturep. 188
System Configurationp. 189
System Reconfiguration on Fault Occurrencep. 191
Processing Take-Over on Fault Occurrencep. 191
Fault Tolerance of Fault Tolerancep. 192
Commercial Product Modelp. 195
Current Application Field: X-by-Wirep. 196
Referencesp. 198
Challenges in the Futurep. 201
Referencesp. 202
Indexp. 203
Table of Contents provided by Ingram. All Rights Reserved.

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