LED Packaging for Lighting Applications Design, Manufacturing, and Testing
by Liu, Shen; Luo, XiaobingEdition: 1st
Format: Hardcover
Pub. Date: 2011-07-05
Publisher(s): Wiley
Other versions by this Author
-
Free Shipping On Orders Over $35
Your order must be $35 or more to qualify for free economy shipping. Marketplace items, eBooks and apparel do not qualify towards the $35 purchase minimum.
List Price: $191.94
Buy New
Usually Ships in 8 - 10 Business Days.
$191.75
Rent Textbook
Select for Price
Used Textbook
We're Sorry
Sold Out
eTextbook
We're Sorry
Not Available
How Marketplace Works:
- This item is offered by an independent seller and not shipped from our warehouse
- Item details like edition and cover design may differ from our description; see seller's comments before ordering.
- Sellers much confirm and ship within two business days; otherwise, the order will be cancelled and refunded.
- Marketplace purchases cannot be returned to eCampus.com. Contact the seller directly for inquiries; if no response within two days, contact customer service.
- Additional shipping costs apply to Marketplace purchases. Review shipping costs at checkout.
Summary
Helps practitioners significantly shorten the time for design, manufacturing, and testing of LED packaging In LED Packaging and Applications, Liu and Luo introduce key LED packaging technologies: optical design, mechanical and thermal management, and reliability issues, along with introductions of several practical applications. Liu and Luo start by familiarizing readers with LED device physics and sample applications. The authors then cover the optical properties of LED output light, and how to manipulate and optimize emission characteristics. Liu and Luo then detail thermal management of LED packaging -- a critical issue in high power LED and solid-state lighting applications, along with reliability issues in LED packaging. Many concepts in design and processes in manufacturing and testing are proposed for the first time, and concepts are presented with a co-design approach to minimize the time to market for LED products. One of the only books to cover LEDs from package design to manufacturing to testing Contains real-world examples for practitioners to understand the concepts quickly Covers the steps needed to transform an LED chip into a competitive lighting product Includes in-depth discussion of reliability issues Presents the state of the art in LED packaging research Codes and demonstrations available from the book's Companion Website
Author Biography
Sheng Liu, Huazhong University of Science and Technology, P.R. China Xiaobing Luo, Huazhong University of Science and Technology, P.R. China
Table of Contents
| Foreword | p. ix |
| Foreword | p. xi |
| Foreword | p. xiii |
| Preface | p. xv |
| Acknowledgments | p. xix |
| About the Authors | p. xxi |
| Introduction | p. 1 |
| Historical Evolution of Lighting Technology | p. 1 |
| Development of LEDs | p. 2 |
| Basic Physics of LEDs | p. 6 |
| Materials | p. 6 |
| Electrical and Optical Properties | p. 10 |
| Mechanical and Thermal Properties | p. 18 |
| industrial Chain of LED ' | p. 19 |
| LED Upstream Industry | p. 21 |
| LED Midstream Industry | p. 22 |
| LED Downstream Industry | p. 22 |
| Summary | p. 28 |
| References | p. 29 |
| Fundamentals and Development Trends of High Power LED Packaging | p. 33 |
| Brief Introduction to Electronic Packaging | p. 33 |
| About Electronic Packaging and Its Evolution | p. 33 |
| Wafer Level Packaging, More than Moore, and SiP | p. 36 |
| LED Chips | p. 37 |
| Current Spreading Efficiency | p. 37 |
| Internal Quantum Efficiency | p. 41 |
| High Light Extraction Efficiency | p. 43 |
| Types and Functions of LED Packaging | p. 48 |
| Low Power LED Packaging | p. 49 |
| High Power LED Packaging | p. 50 |
| Key Factors and System Design of High Power LED Packaging | p. 51 |
| Development Trends and Roadmap | p. 57 |
| Technology Needs | p. 57 |
| Packaging Types | p. 59 |
| Summary | p. 62 |
| References | p. 62 |
| Optical Design of High Power LED Packaging Module | p. 67 |
| Properties of LED Light | p. 67 |
| Light Frequency and Wavelength | p. 67 |
| Spectral Distribution | p. 69 |
| Flux of Light | p. 69 |
| Lumen Efficiency | p. 71 |
| Luminous Intensity, Illuminance and Luminance | p. 71 |
| Color Temperature, Correlated Color Temperature and Color Rendering Index | p. 76 |
| White Light LED | p. 80 |
| Key Components and Packaging Processes for Optical Design | p. 83 |
| Chip Types and Bonding Process | p. 83 |
| Phosphor Materials and Phosphor Coating Processes | p. 85 |
| Lens and Molding Process | p. 90 |
| Light Extraction | p. 93 |
| Optical Modeling and Simulation | p. 98 |
| Chip Modeling | p. 98 |
| Phosphor Modeling | p. 102 |
| Phosphor for White LED Packaging | p. 108 |
| Phosphor Location for White LED Packaging | p. 108 |
| Phosphor Thickness and Concentration for White LED Packaging | p. 118 |
| Phosphor for Spatial Color Distribution | p. 123 |
| Collaborative Design | p. 129 |
| Co-design of Surface Micro-Structures of LED Chips and Packages | p. 129 |
| Application Specific LED Packages | p. 134 |
| Summary | p. 144 |
| References | p. 144 |
| Thermal Management of High Power LED Packaging Module | p. 149 |
| Basic Concepts of Heat Transfer | p. 149 |
| Conduction Heat Transfer | p. 150 |
| Convection Heat Transfer | p. 150 |
| Thermal Radiation | p. 151 |
| Thermal Resistance | p. 153 |
| Thermal Resistance Analysis of Typical LED Packaging | p. 154 |
| Various LED Packages for Decreasing Thermal Resistance | p. 156 |
| Development of LED Packaging | p. 156 |
| Thermal Resistance Decrease for LED Packaging | p. 158 |
| SiP/COB LED Chip Packaging Process | p. 162 |
| Summary | p. 164 |
| References | p. 164 |
| Reliability Engineering of High Power LED Packaging | p. 167 |
| Concept of Design for Reliability (DfR) and Reliability Engineering | p. 167 |
| Fundamentals of Rehability | p. 168 |
| Life Distribution | p. 169 |
| Accelerated Models | p. 172 |
| Applied Mechanics | p. 175 |
| High Power LED Packaging Reliability Test | p. 179 |
| Traditional Testing Standards, Methods, and Evaluation | p. 179 |
| Methods for Failure Mechanism Analysis | p. 182 |
| Failure Mechanisms Analysis | p. 184 |
| Rapid Reliability Evaluation | p. 187 |
| Material Property Database | p. 190 |
| Numerical Modeling and Simulation | p. 194 |
| Summary | p. 211 |
| References | p. 211 |
| Design of LED Packaging Applications | p. 215 |
| Optical Design | p. 215 |
| Introduction of Light Control | p. 215 |
| Reflectors | p. 220 |
| Lenses | p. 232 |
| Diffuser | p. 272 |
| Color Design and Control in LED Applications | p. 277 |
| Thermal Management | p. 287 |
| Analysis of System Thermal Resistance | p. 287 |
| Types of Heat Dissipation to Environment | p. 293 |
| Design and Optimization of Fin Heat Sink | p. 298 |
| Design Examples of Thermal Management of Typical LED Lighting Systems | p. 303 |
| Drive Circuit and Intelligent Control Design | p. 311 |
| Typical LED Wireless Intelligent Control System | p. 311 |
| Working Principles of Wireless Intelligent Control System | p. 312 |
| Summary | p. 313 |
| References | p. 313 |
| LED Measurement and Standards | p. 317 |
| Review of Measurement for LED Light Source | p. 317 |
| Luminous Flux and Radiant Flux | p. 318 |
| Measurement for Luminous Intensity | p. 319 |
| LED Chromaticity Coordinates | p. 320 |
| Dominant Wavelength Determination Algorithm | p. 321 |
| Curve Fitting Method | p. 321 |
| LED Color Purity | p. 322 |
| Color Temperature and Correlated Color Temperature of Light Source | p. 323 |
| Automatic Sorting for LEDs | p. 324 |
| Measurement for LED Road Lights | p. 325 |
| Electrical Characteristics | p. 325 |
| Color Characteristics | p. 326 |
| Light Distribution Characteristics | p. 326 |
| Dynamic Characteristics | p. 326 |
| Test of Reliability | p. 329 |
| Summary | p. 329 |
| References | p. 329 |
| Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance | p. 331 |
| Index | p. 349 |
| Table of Contents provided by Ingram. All Rights Reserved. |
An electronic version of this book is available through VitalSource.
This book is viewable on PC, Mac, iPhone, iPad, iPod Touch, and most smartphones.
By purchasing, you will be able to view this book online, as well as download it, for the chosen number of days.
Digital License
You are licensing a digital product for a set duration. Durations are set forth in the product description, with "Lifetime" typically meaning five (5) years of online access and permanent download to a supported device. All licenses are non-transferable.
More details can be found here.
A downloadable version of this book is available through the eCampus Reader or compatible Adobe readers.
Applications are available on iOS, Android, PC, Mac, and Windows Mobile platforms.
Please view the compatibility matrix prior to purchase.